The HybridPACK Drive G2 will be available in various current ratings and voltage classes (750 V and 1200 V) and will incorporate Infineon’s next-generation EDT3 (Si IGBT) and CoolSiC G2 MOSFET chip technologies.
With a power range of up to 300 kW in the 750 V and 1200 V classes, the power module offers a high level of user-friendliness and new functions. These include the integration option for a next-generation phase current sensor and on-chip temperature detection. Both reduce system costs. The power module achieves higher performance and power density through improved assembly and interconnection technologies. The introduction of new sintering interconnect technology and new materials results in a higher usable temperature range. This in turn increases both the performance and the lifetime of the product. Motor Protection
The first generation (G1) of the HybridPACK Drive was launched in 2017 and uses silicon EDT2 technology. It offers a power range from 100 kW to 180 kW in the 750 V class. In 2021, Infineon expanded the product family with the first generation of HybridPACK Drive Automotive CoolSiC MOSFETs, which enables higher power of up to 250 kW in the 1,200 V class in traction inverters. The module helps extend range, reduce battery size and optimise system sizes and costs. So far, the HybridPACK has been installed in nearly three million vehicles.
The main products (FS1150R08, FS01MR08, FS02MR12) of the new HybridPACK Drive G2 are in series production and will be available from May. The product will be presented at PCIM Europe 2023.
Additional product variants are to follow in 2023 and 2024. Eval kits and design-in support are available to enable quick and easy evaluation for customers.
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